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The Semiconductor Chessboard
How TSMC and AMAT Play for the Future

This table provides a comprehensive overview of the key players, technological advancements, and strategic decisions shaping the semiconductor landscape. Focus areas include TSMC’s node evolution, AMAT’s supplier dominance, pricing power dynamics, and the broader implications of transitioning from FinFET to GAA transistors.

In the high-stakes game of semiconductors, think of TSMC, AMAT, Intel, and Samsung as the players on an ever-shifting chessboard. Except here, the board is littered with intricate moves, pricing pressures, and tech leaps as they scale up from FinFET to gate-all-around (GAA) transistors. This is a game investors need to watch closely – it's about getting and keeping the lead in a hypercompetitive landscape where yield and performance are more important than ever.
1. The Evolution from FinFET to Gate-All-Around: Scaling Like a Game of Tetris
Let's start with something simple: Imagine your game of Tetris. You’ve got blocks, you keep stacking them neatly to build walls, until things get tight. Now picture TSMC back in 2017 trying to optimize their FinFET transistors – just like stacking those Tetris blocks higher and narrower. Except they reached a point where the “block” couldn’t get any taller without major risks to the game – performance was starting to drop off, yields were becoming unpredictable.
The solution? Flip the blocks sideways, and start stacking more. That’s basically what gate-all-around (GAA) is doing for TSMC’s transistor technology. After years of squeezing performance out of FinFET since Intel launched it in 2012, everyone from Samsung to Intel and TSMC has been working on this new design. Samsung pulled the trigger first, introducing GAA in 2023, but TSMC decided to wait until 2025 for better reliability and higher yield.
From 2D to 3D NAND – Stack It Like a Champion!

2. The Ramp-Up Process: From R&D to Pilot, to Volume – The Tedious Climb
The journey of bringing new node technology to high-volume manufacturing (HVM) at TSMC is akin to climbing Everest—it starts with exploration, then technical camps, and finally the grueling summit push. Each phase has its own distinct challenges.
R&D is that base camp, where unit processes are tested and tweaks are made at the atomic level. The goal is to get everything right before the pilot. TSMC partners with equipment manufacturers like AMAT, and, during this phase, suppliers are locked into specifications – not unlike making sure your oxygen tanks work before reaching the summit. This "copy exact" mentality makes sure that what worked at base camp works when the real climb starts.
From the pilot phase to volume production, it's all about replication. And the industry relies on "Copy Exact" strategies to ensure no surprise fails at high volume. Once TSMC signs off at the pilot level, any modifications are minimal—they've got their climbing route, and every move must be in place.
Node Ramp-Up Process Over Time

3. AMAT’s Role: The PVD Supplier and Market Negotiations
Think of Applied Materials (AMAT) as the Swiss Army knife that TSMC brings along for the climb. For metal deposition, specifically physical vapor deposition (PVD), AMAT holds 90% of TSMC's business. Why? Because they’re that one tool that’s reliable, and reliability is king when you're talking about processing millions of wafers for iPhones and GPUs.
AMAT doesn't just supply tools; they're the ones helping TSMC optimize every part of the process. The negotiation goes beyond price: it’s a dance around performance, integration, and supply chain challenges. If TSMC finds a better supplier who can push harder at the next node, they’ll switch in a heartbeat. It’s why companies like AMAT keep “copy exact” records for TSMC while tweaking versions of products for other clients—it’s all about keeping this delicate partnership balanced.
Navigating TSMC’s Node Evolution, AMAT’s Supplier Power, and the Shift to GAA Technology

4. Pricing Power and Volume Deals: Who Holds the Cards?
The semiconductor equipment market is all about who has leverage. AMAT holds about 90% market share for PVD at TSMC, but that doesn’t mean they always have the upper hand when it comes to pricing. TSMC’s size and dominance mean they can strong-arm suppliers into better deals, bundling less critical tools with the more essential ones to maintain an edge.
Pricing power, then, is less about sheer volume and more about the competitive landscape. For highly differentiated products like PVD, AMAT can hold the line. But where competitors are closing in, like in etch, it’s a different game altogether. TSMC wants multiple suppliers, not just for leverage but also for redundancy – and they use this competition to drive costs down.
Pricing Power Dynamics: TSMC vs. AMAT in the Semiconductor Supply Chain

5. Moving from FinFET to GAA: Risks vs. Rewards
Samsung jumped first to GAA in 2023, pushing out their 3nm node and claiming the first step on the ladder. But TSMC held back. Why? Because for TSMC, pushing new tech early without making sure it’s profitable isn’t part of their playbook. Their focus was getting yields higher, pushing costs lower, and not losing any clients.
This was a lesson in risk mitigation. Samsung has always been a bit of a gambler, willing to trade short-term profitability for market share. TSMC, however, likes steady gains, focusing on lead times, customer retention, and reliability. Their 2nm node will include GAA, but only after Samsung and Intel have played with theirs—making sure TSMC’s late move will still be highly lucrative.
GAA Transistor Rollout: Samsung, Intel, and TSMC’s Race to Next-Gen Nodes

6. TSMC’s Supply Chain Complexity: The Cost of Scale
Building semiconductors isn't just about having the most advanced nodes, it’s also about making sure all the pieces fit. For TSMC, running fabs in Taiwan means the supply chain is localized—speedy lead times and fewer surprises. But expanding to Arizona, as part of geopolitical balancing and the U.S. CHIPS Act, has opened Pandora’s box of challenges.
Lead times for critical components are extended, regulatory hurdles are piling up, and labor inefficiencies have made Arizona a logistical headache. Despite all this, the expansion is crucial for diversifying risks and maintaining key U.S. clients like Apple and NVIDIA, who are interested in local production.

7. Concluding Thoughts: Where the Chips Fall
The semiconductor industry is like playing chess in a thunderstorm – the board keeps getting hit, pieces are shifting, and every move requires not just foresight but sheer tenacity. TSMC, AMAT, Samsung, and Intel are all pushing the boundaries, trying to keep their technology one step ahead while also not getting knocked off by the market forces at play.
Investors looking at the semiconductor space should be aware: the next few years are about who manages their production, partnerships, and pricing the best. TSMC might be cautious in GAA, but that caution could spell profitability and sustainability for years to come, whereas Samsung’s early moves could be a risky gamble.
The Semiconductor Chessboard: Strategic Moves by TSMC, Samsung, and AMAT in Market Dominance and Technology Readiness

